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Bottom pads

The bottom pads of Helix128-2.0/2.1 are explained in table 9 on page [*]. The bottom pads of Helix128-2.2/2.3 are explained in table 10 and 11 on page [*] and [*], respectively.


 

 
Table 9: Pads on the bottom side of Helix128-2.0/2.1. The first pad in the table corresponds to the very left hand pad of the bottom side (with the frontside left).
Ref. no. Pin name Type Description
133,134 Gnda supply analog ground (0V)
135,136 Vssa supply negative analog supply voltage (-2V)
137,138 Vdda supply positive analog supply voltage (+2V)
139 VssComp supply negative supply voltage for comparator (-2V)
140 VddComp supply positive supply voltage for comparator (+2V)
141 notCompClk input active low comparator dummy clock
142 CompClk input active high comparator clock
143 CompPol input polarity switch for comparator +2V$\Rightarrow$ detection of positive signals
144 notCompOut$\langle$31$\rangle$
718{output (open drain)}
720ORed active low output of comparators on channels 127...124
145 notCompOut$\langle$30$\rangle$
723{output (open drain)}
725ORed active low output of comparators on channels 123...120
146-173      
174 notCompOut$\langle$1$\rangle$
729{output (open drain)}
731ORed active low output of comparators on channels 7...4
175 notCompOut$\langle$0$\rangle$
734{output (open drain)}
736ORed active low output of comparators on channels 3...0
176 MuxDisable
739{input (int. pulldown)}
Out of use
177 TransmitEnable
742{input (int. pullup)}
-2V disables analog data transmission
178 FifoFull output indicates readout fifo overflow.
179 HelixTokenIn input 746to be connected to pad no. 257 HelixTokenOut of predecessing Helix128-2.0/2.1 if the chip is nonleading in a daisy chain (not to be connected for single chip operation and if the chip is the first in a daisy chain)
180 ReturnTokenOut output 749to be connected to pad no. 256 ReturnToken-In of predecessing Helix128-2.0/2.1 if the chip is nonleading in a daisy chain (not to be connected for single chip operation and if the chip is the first in a daisy chain)
181 SyncIn$\langle$0$\rangle$
753{input (int. pullup)}

755{synchronicity monitoring input from neighbouring Helix128-2.0/2.1}
182 SyncIn$\langle$1$\rangle$
758{input (int. pullup)}
``
183-185      
186 SyncIn$\langle$5$\rangle$
764{input (int. pullup)}
766 ``
187-197 n. c.    



 

 
Table 10: Pads on the bottom side of Helix128-2.2/2.3. The first pad in the table corresponds to the very left hand pad of the bottom side (with the frontside left). See table 11 for pads 179$\ldots$197a.
Ref. no. Pin name Type Description
133,134 Gnda supply analog ground (0V)
135,136 Vssa supply negative analog supply voltage (-2V)
137,138 Vdda supply positive analog supply voltage (+2V)
138a GndComp supply Reference voltage for comparators' AC coupling
139 VssComp supply negative supply voltage for comparator (-2V)
140 VddComp supply positive supply voltage for comparator (+2V)
141 notCompClk LVDS-input active high comparator dummy clock
142 CompClk LVDS-input active low comparator clock
143 CompPol input polarity switch for comparator +2V$\Rightarrow$ detection of positive signals
144 notCompOut$\langle$31$\rangle$
785{output (open drain)}
787ORed active low output of comparators on channels 127...124
145 notCompOut$\langle$30$\rangle$
790{output (open drain)}
792ORed active low output of comparators on channels 123...120
146-173      
174 notCompOut$\langle$1$\rangle$
796{output (open drain)}
798ORed active low output of comparators on channels 7...4
175 notCompOut$\langle$0$\rangle$
801{output (open drain)}
803ORed active low output of comparators on channels 3...0
176 VssComp supply -2V supply for notCompOut$\langle$1$\rangle$
177 TransmitEnable
808{input (int. pullup)}
-2V disables analog data transmission
178 FifoFull output indicates readout fifo overflow.
178a VssComp supply -2V supply for notCompOut$\langle$1$\rangle$



 

 
Table 11: Pads on the bottom side of Helix128-2.2/2.3 (continued). The first pad in the table corresponds to the very left hand pad of the bottom side (with the frontside left). See table 10 for pads 133$\ldots$178a.
Ref. no. Pin name Type Description
179 notHelixTokenOut output Reserved for future use
180 notReturnTokenIn input Reserved for future use
180a ReturnTokenIn input return path token input; must be bonded to pad no. 187 HelixTokenOut if the chip is the last in the daisy chain and for single chip operation (otherwise bonded to pad no. 257a ReturnTokenOut of following chip in the daisy chain)
181 SyncIn$\langle$0$\rangle$
826{input (int. pullup)}

828{synchronicity monitoring input from neighbouring Helix128-2.2/2.3}
182 SyncIn$\langle$1$\rangle$
831{input (int. pullup)}
833 ``
183-185      
186 SyncIn$\langle$5$\rangle$
837{input (int. pullup)}
839 ``
187 HelixTokenOut output must be bonded to pad no. 180a Return-TokenIn if the chip is the last in the daisy chain and for single chip operation (otherwise bonded to pad no. 251 HelixTokenIn of following chip in the daisy chain)
188 notFailsafe- output Reserved for future use
  HelixTokenOut    
189 notFailsafe- input Reserved for future use
  ReturnTokenIn    
190 Failsafe- input Reserved for future use
  ReturnTokenIn    
191 Failsafe- output Reserved for future use
  HelixTokenOut    
192 n. c.    
193-197a     Removed



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Table 12: Pads on the bottom side of Helix128-3.0 (continued). The first pad in the table corresponds to the very left hand pad of the bottom side (with the frontside left). See table 10 for pads 133$\ldots$178a.
Ref. no. Pin name Type Description
179 n. c.   Reserved for future use
       
180 notReturnTokenIn input Reserved for future use
180a ReturnTokenIn input return path token input; must be bonded to pad no. 187 HelixTokenOut if the chip is the last in the daisy chain and for single chip operation (otherwise bonded to pad no. 257a ReturnTokenOut of following chip in the daisy chain)
181 SyncIn$\langle$0$\rangle$ input (int. synchronicity monitoring input from
    pullup) neighbouring Helix128-2.2/2.3
182 SyncIn$\langle$1$\rangle$ input (int.  
    pullup) [-1.5ex] ``
183-185      
186 SyncIn$\langle$5$\rangle$ input (int.  
    pullup) [-1.5ex] ``
187 HelixTokenOut output must be bonded to pad no. 180a Return-TokenIn if the chip is the last in the daisy chain and for single chip operation (otherwise bonded to pad no. 251 HelixTokenIn of following chip in the daisy chain)
188 n. c.   Reserved for future use
189 874notFailsafeReturnTokenIn input 876To be connected to notFailsafeReturnTokenOut of the next but one chip in the chain.
190 878FailsafeReturnTokenIn input 880To be connected to FailsafeReturnTokenOut of the next but one chip in the chain.
191 882FailsafeHelixTokenOut output 884To be connected to FailsafeHelixTokenIn of the next but one chip in the chain.
192 n. c.   Reserved for future use
193-197a     Removed



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next up previous contents
Next: Rear pads Up: Appendix: Pad Description Previous: Front pads

Martin Feuerstack
2/3/1999